Using Grid Search Methods and Parallel Computing to Reduce AI Training Time for Reliability Lifetime Prediction of Wafer-Level PackagingChang, C. Y., Lee, C. H., & Chiang, K. N. (2023). Using grid search methods and parallel computing to reduce ai training time for reliability lifetime prediction of wafer-level packaging. 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2023 24th International Conference On, 1–5. https://doi.org/10.1109/EuroSimE56861.2023.10100751
The paper presents a grid search method leveraging parallel computing with the objective of reducing AI training time for reliability.